HANHWA
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Features of FB-x26 Wide bonding area (Y: 95mm) .
Capable of large IC device production .
New bonding head, rigid and lightweight satisfies high accurate bonding performance and low impact load to boards .
Composite bonding arm 1701 lightweight mini-hom High speed touch detector .
Capable of alloy wire(Ag/Cu )bonding optionally.
User friendly new operational environment by Windows.
